Sunday, 2 July 2017

Advanced Thermally Conductive Adhesives for High Power Electronics

Today’s electronic devices are smaller, more component-dense and need more power than ever, especially for handheld devices. Heat loads are increasing as a result – threatening the functionality of the devices we’ve come to rely on.

Engineers have historically used active and passive cooling techniques (ex., fans and heat sinks) with thermal interface materials to provide a reliable heat flow path between component and thermal transfer surface. These materials traditionally include thermal greases applied between power dissipating and cooling components, such as a microprocessor and its heat sink.

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