Direct bonding to emerge out as the fastest growing wafer bonding system market in the near future
Direct bonding or fusion bonding, is a wafer bonding process that does not include any additional intermediate layer for generating the chemical bonds between the two surfaces of desired material. Direct bonding is mainly used for the manufacturing of Silicon on Insulator (SOI) wafers, sensors and actuators. One advantage of direct bonding is that the wafers come out with a smooth and clean surfaces having a direct contact without any significant pressure. The most attractive feature driving the growth of this segment is the set of advantages offered by this process, such as high bonding strength, high temperature stability, process compatibility to semiconductor technology, and ability to bond in vacuum or different atmospheric gases as well. The very segment held nearly 1/4th of the global market in 2017.
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Direct bonding or fusion bonding, is a wafer bonding process that does not include any additional intermediate layer for generating the chemical bonds between the two surfaces of desired material. Direct bonding is mainly used for the manufacturing of Silicon on Insulator (SOI) wafers, sensors and actuators. One advantage of direct bonding is that the wafers come out with a smooth and clean surfaces having a direct contact without any significant pressure. The most attractive feature driving the growth of this segment is the set of advantages offered by this process, such as high bonding strength, high temperature stability, process compatibility to semiconductor technology, and ability to bond in vacuum or different atmospheric gases as well. The very segment held nearly 1/4th of the global market in 2017.
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