Semiconductor Industry News

Thursday, 6 July 2017

Samsung plans $19b investment to increase semiconductor manufacturing

The second-largest manufacturer of semiconductors in the world wants to lead the global production of memory chips and next-generation smartphone displays. It intends to spend KRW1.4 trillion (US$1.22 billion) on a new NAND flash memory chip factory in Pyeongtaek as well as KRW6 trillion (US$5.23 billion) for a semiconductor facility in Hwaseong.

This year, with a new Apple handset on the horizon, chipmakers worldwide are ramping up their productivity and manufacturing capabilities to keep up with consumer demand. Every memory maker is expected to clock record profits for the 2017 financial year, with ever increasing demand and a persistent shortage driving up the prices of these chips.

Panasonic IoT wireless modules pre-certified at Avnet Abacus

The RF modules from Panasonic cover a range of communication protocols with ready-to-use modules for Bluetooth, Bluetooth Low Energy and Wi-Fi.

“This extended distribution deal with Avnet Abacus delivers an even better choice for engineers looking to add pre-tested, certified and fully supported wireless connectivity into their products,” said Max Jakob, Panasonic’s distribution sales director EMEA, product marketing department.

Panasonic also supports RF network protocols, including Bluetooth, ISM and SNAP, through partnerships with software firms. And is able to offer pre-tested and certified RF modules.

Body Heat Can Be the Source of Power for Wearable Devices

The article, Human Body Heat for Powering Wearable Devices: From Thermal Energy to Application, provides the information implied by its title. Authored by Moritz Thielen, Lukas Sigrist, Michele Magno, Christofer Hierold, and Luca Benini, it describes approaches for powering a wearable device, with details on the use of body heat as the source of power.

Another consideration in powering wearable devices is the necessity to impose weight and size constraints, particularly if you initially choose a battery as the source of power. To limit size and weight you should use energy harvesting instead of the battery. The article points out that you can harvest energy from several environmental sources:

Light, using photovoltaics

Movement of the wearer

Radio frequency energy (RF)

Temperature differences using a thermoelectric generator (TEG)

An evaluation of these environmental sources reveals that photovoltaic or RF harvesters limit the application of zero-power wearables to environments where sufficient ambient light or RF emissions is provided to satisfy the energy budget. Movement-based harvesting systems require an active wearer and usually have unstable power generation characteristics. In contrast, the human body is a constant heat source and typically a temperature difference exists between body core and the environment.

New semiconductor material shows promise for more efficient power electronics

Every year it seems like we have another device to charge — laptops, smartphones, tablets, wearable electronics, electric cars and so on. Charging processes ubiquitously use power electronic switches to convert electricity from one form to another so that it can be used in these devices. As power electronics become increasingly part of how we move and consume electricity, the U.S. Department of Energy (DOE) is looking for new ways to make these devices more powerful, more efficient and more compact.

Semiconductors are a critical part of power electronic devices, which today, are most commonly made of silicon semiconductor. However, silicon gets less efficient as power demands increase, so new materials are needed as power electronics capabilities and performance continue to advance. Gallium nitride (GaN) is a promising new wide-bandgap (WBG) semiconductor material with properties that allow it to operate at higher voltages, frequencies and temperatures at higher efficiencies than silicon.

How IT sensors help businesses cut carbon footprint

The accumulation of greenhouse gases (GHGs) in our atmosphere has led to noticeable changes in natural systems. Ocean acidification and increasing ocean temperatures are damaging marine ecosystems. Each year, at least eight million tonnes of plastics find their way into the ocean - which is equivalent to dumping the contents of one bin lorry into the ocean every minute. Further still, the increased frequency and severity of extreme weather events are putting many more at greater risk.

We all know that to limit the likelihood of disruptive and potentially catastrophic change to our climate and ecosystems, public and private institutions across the planet will need to develop and implement mitigation and adaptation strategies.

This bleak outlook needs to serve as a call to action for governments, businesses and the general public alike to do their part to enact change. But where to start?

Intel Is About to Lose Its Semiconductor Crown

According to the Financial Times, Intel (NASDAQ:INTC) is about to lose its position as the leading chipmaker. It's a position Intel has had since it began dominating the PC processor space back in 1993, but this quarter, Samsung's (NASDAQOTH:SSNLF) chip sales will outpace Intel's -- and there may be no going back.

The past 10 years haven't been good to Intel as mobile phones and tablets have taken over, and PC sales have continued to decline. Intel famously missed its chance to supply mobile devices with its processor, and Samsung stepped in to fill the void by supplying chips for its own devices (as well as for competitors) and building out a massive memory chip business as well.

Advanced Thermally Conductive Adhesives for High Power Electronics

Today’s electronic devices are smaller, more component-dense and need more power than ever, especially for handheld devices. Heat loads are increasing as a result – threatening the functionality of the devices we’ve come to rely on.

Engineers have historically used active and passive cooling techniques (ex., fans and heat sinks) with thermal interface materials to provide a reliable heat flow path between component and thermal transfer surface. These materials traditionally include thermal greases applied between power dissipating and cooling components, such as a microprocessor and its heat sink.