The Rochester, NY-based consortium AIM Photonics (American Institute for Manufacturing Photonics) - an industry-driven public-private partnership advancing the USA’s photonics manufacturing capabilities - has announced the winner of a proposal call for a new Defense Department Government Directed Project for photonic integrated circuit (PIC) data links for cryogenic focal plane arrays (FPAs).
The $1,200,000 US Department of Defense (DoD) project, along with an additional $400,000 in matching funds from a team led by the University of Arizona (UA), will support a consortium that includes Sandia National Labs, Raytheon (RTN) and other aerospace firms engaged in FPA technology.
The project will encompass the design, fabrication and test of cryogenic PIC-based datalinks for FPA readout and has the potential to strongly advance imaging capabilities for national defense applications. Capitalizing on the national reach and capabilities of this consortium, the PICs will be manufactured in the AIM Photonics silicon photonics fabrication facility at SUNY Polytechnic Institute in Albany, NY, and could also lead to fabrication opportunities at AIM Photonics’ Test, Assembly, and Packaging (TAP) facility, which is being built in in Rochester, NY.
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